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HotChips - Symposium on High Performance Chips

HotChips 2023

Submission Page

To revise a previous submission, please type the submission passcode below, and press the ENTER button.

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Title of Submission:

List of Authors:

Please enter the complete list of authors for your submission, in the order in which they will appear on the abstract. You can add as many author slots as you want, to accommodate the total number of authors for your submission.

	First name(s)	Last name	Email	Affiliation
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More Authors Fewer Authors

Contact Information:

Title
First Name (*) (Mandatory)
Last name (*) (Mandatory)
Affiliation/organization
Affiliation Dept/Lab
Job Title
Phone
Mobile
Fax
Email (*) (Mandatory) (E-mail not valid)

Country
Address
Address
Address
City/Town
State/Province
Zip/Postal Code

Submission Categories:

Please enter the categories under which the submission should be reviewed.

Submission Type (*):

Submission to Another Conference:

Expected Chip Status at time of presentation.

Summary:

Type (or cut-and-paste) a short summary for your submission. You must enter plain text only, and you may not exceed 4000 words.

Submission Files:

A file's name should have the proper MIME extent associated with its document type. For example, a pdf file should have a name such as "mypaper.pdf".
Find the files for your submission:

File:

Extra File (if needed):

Keywords/Topics:

Please use the list of topics below to characterize your submission. Check all categories that seem appropriate.

	Microprocessors
	Chipset Chips
	Systems-on-Chip
	Embedded Processors
	Digital Signal Processors
	Application-Specific Processors
	Network/Security Processors
	Graphics/Multimedia/Game Processors/Display Technology
	Communication/Networking Chips
	Wireless LAN/Wireless WAN Chips

	Novel Chips: Quantum Computing, Nano-structures, Micro-array
	Low-power Chips/Dynamic Power Management
	Reconfigurable Chips/Processors
	Chips Built from FPGAs
	Reliability and Design for Test
	Compiler Technology
	Operating System/Chip Interaction
	Advanced Semiconductor Process Technology
	Advanced Packaging Technology
	Performance Evaluation
	Other

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